2014.4.1: * Version 2.0 (Rev. 6) * No changes 2014.4: * Version 2.0 (Rev. 6) * No changes 2014.3: * Version 2.0 (Rev. 6) * Example design updated to have ATG mask change dynamically based on GPIO widths * AXI GPIO uses new libraries and axi_lite_ipif subcores * Updating core to use utils.tcl needed for board flow from common location * Disabling customization of the appropriate GPIO if board interface has been used 2014.2: * Version 2.0 (Rev. 5) * Example design XDC update for timing DRC * Updated board flow commands in sync with internal flow updates, no functional changes. 2014.1: * Version 2.0 (Rev. 4) * Internal device family name change, no functional changes * Virtex UltraScale Pre-Production support. 2013.4: * Version 2.0 (Rev. 3) * Board interface connection for GPIO2 enabled by default * Updated Example design to use Clocking Wizard to generate clocks * Kintex UltraScale Pre-Production support 2013.3: * Version 2.0 (Rev. 2) * Added example design and demonstration testbench * Reduced warnings in synthesis and simulation * Enhanced support for IP Integrator * Added support for Cadence IES and Synopsys VCS simulators * Updated synchronizers for clock domain crossing to reduce Mean Time Between Failures (MTBF) from metastability * Improved GUI speed and responsiveness, no functional changes 2013.2: * Version 2.0 (Rev. 1) * Enable support for future devices * There have been no functional or interface changes to this IP. 2013.1: * Version 2.0 * Native Vivado Release * There have been no functional or interface changes to this IP. The version number has changed to support unique versioning in Vivado starting with 2013.1. (c) Copyright 2012 - 2015 Xilinx, Inc. All rights reserved. This file contains confidential and proprietary information of Xilinx, Inc. and is protected under U.S. and international copyright and other intellectual property laws. DISCLAIMER This disclaimer is not a license and does not grant any rights to the materials distributed herewith. Except as otherwise provided in a valid license issued to you by Xilinx, and to the maximum extent permitted by applicable law: (1) THESE MATERIALS ARE MADE AVAILABLE "AS IS" AND WITH ALL FAULTS, AND XILINX HEREBY DISCLAIMS ALL WARRANTIES AND CONDITIONS, EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, NON- INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether in contract or tort, including negligence, or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under or in connection with these materials, including for any direct, or any indirect, special, incidental, or consequential loss or damage (including loss of data, profits, goodwill, or any type of loss or damage suffered as a result of any action brought by a third party) even if such damage or loss was reasonably foreseeable or Xilinx had been advised of the possibility of the same. CRITICAL APPLICATIONS Xilinx products are not designed or intended to be fail- safe, or for use in any application requiring fail-safe performance, such as life-support or safety devices or systems, Class III medical devices, nuclear facilities, applications related to the deployment of airbags, or any other applications that could lead to death, personal injury, or severe property or environmental damage (individually and collectively, "Critical Applications"). Customer assumes the sole risk and liability of any use of Xilinx products in Critical Applications, subject only to applicable laws and regulations governing limitations on product liability. THIS COPYRIGHT NOTICE AND DISCLAIMER MUST BE RETAINED AS PART OF THIS FILE AT ALL TIMES.